Enabling Thermal Management in Reusable 2.5D Integrated Systems

Release Time：2023-09-19Number of visits：79

Speaker:  Vasilis Pavlidis, Aristotle University of Thessaloniki.

Time:       14:00-15:00 am, Sept.20

Location: SIST 1A200

Host:        Xin Lou

Abstract:

  

2.5D integration has been a successful integration paradigm commercialized to date by enterprises that support vertical business from devices to systems. The potential of 2.5D integration, however, will be fully unleashed only if modular and reusable design processes are developed that enable rapid deployment of different architectures on a smart interconnect fabric. This talk, therefore, emphasizes interposers and presents new methods to capture accurately and with low overhead the temperature across the entire system, thereby underpinning holistic thermal management policies since the thermal coupling among the system components is effectively captured. New circuits and algorithms are presented demonstrating the advantages over state-of-the-art approaches and results for different 2.5D systems connected by either passive or active interposers are also discussed.




Bio:

  

  

Vasilis Pavlidis is currently an Associate Professor of Digital Integrated Circuit Design (VLSI) and Design Automation for VLSI Systems, Aristotle University of Thessaloniki. Dr. Pavlidis holds a BSc and MEng degree in Electrical and Computer Engineering, Democritus University of Thrace, Xanthi Greece awarded in 2000 and 2002, respectively. He also holds a MSc and PhD degree in Electrical and Computer Engineering, University of Rochester, Rochester, NY, USA, awarded in 2003 and 2008, respectively. In September 2012, he joined the Department of Computer Science at the University of Manchester, UK, where he was promoted to a Senior Lecturer (Associate Professor) in 2018. In 2019, he joined AUTH as an Associate Professor. He has 70+ publications (as of Aug. 2019) in peer-reviewed international conference proceedings and journals and he is the leading author of the title “Three-Dimensional Integrated Circuit Design”, published by Morgan Kaufmann Publishers (1st edition: 2008, 2nd edition: 2017) that was also translated in Chinese (2014). He is a Senior Member of the IEEE and serves (or served) in Technical Program Committees of conferences, such as ISCAS, DATE, ICCD, ICECS, etc and is an Associate Editor of international journals including Microelectronics Journal, Integration the VLSI Journal, IEEE Transactions on VLSI.