Speaker: Prof. Songbin Gong
Time: 10:00-11:00, Mar. 18
Location: SIST 1A-200
Host: Prof. Tao Wu
Abstract:
Recently, 5G and IoT have sparked great research interest in developing the next generation front ends that can meet the more stringent requirements on performance, frequency scalability, bandwidth, power consumption, and spectral utilization efficiency. This talk will discuss several new types of RF micro-systems that can enable various front-end functions, including filtering, radiation, non-reciprocity, and equalization, with unprecedented size, weight, and performance (SWaP) for 5G and IoT applications. Specifically, the most recent development on lithium niobate MEMS resonators, filters, delay lines, and circulators from 100s MHz to 30 GHz will be first presented and followed by the discussion on crosscutting acoustics and electromagnetics to miniaturize antennas without compromising their performance.
Bio:
Prof. Songbin Gong received his Ph.D. degree in Electrical Engineering from the University of Virginia, Charlottesville, VA, USA, in 2010. He is currently an Assistant Professor and an Intel Alumni Fellow with the Department of Electrical and Computer Engineering and the Micro and Nanotechnology Laboratory, University of Illinois at Urbana–Champaign, Urbana, IL, USA. His research primarily focuses on the design and implementation of RF-MEMS devices, components, and subsystems for reconfigurable RF front ends. In addition, his research explores hybrid microsystems based on the integration of MEMS devices with circuits or photonics for signal processing. He is a recipient of the 2014 Defense Advanced Research Projects Agency Young Faculty Award, the 2017 NASA Early Career Faculty Award, and 2019 Dean’s Award for Excellence in Research. Along with his students and postdocs, he received the Best Paper Awards from the 2017 IEEE International Frequency Control Symposium and the 2018 IEEE International Ultrasonic Symposium and the 2nd place in the Best Paper Competition at 2018 International Microwave Symposium. He has been a guest editor for the special issue on RF-MEMS in the Journal of Micromechanics and Microengineering, and also a Technical Committee Member of MTT-21 RF-MEMS of the IEEE Microwave Theory and Techniques Society, International Frequency Control Symposium, and International Electron Devices Meeting.
SIST-Seminar 18133