Chaofeng Ye
Assistant Professor
Graduated School:Ph.D., Michigan State University, USA
Tel:(021) 20685366
Office:Room 1D-301E, SIST Building
Research Interests
Biography
Selected Publications

RESEARCH INTERESTS

  • Non-destructive testing

  • Bio-electromagnetic measurement

  • Electromagnetic precision sensing

  • Intelligent image and signal processing


BIOGRAPHY

Dr. Chaofeng Ye received Ph.D. degree in electrical engineering from Michigan State University, USA, in 2016 and M.S. degree in electrical engineering from Tsinghua University, China, in 2008. He worked in the department of electrical engineering of Tsinghua University from 2008 to 2013 and in Michigan State University as a Postdoc from 2016-2017.  His main research areas include non-destructive testing (finite element method simulation, R&D of new array sensors), bio-electromagnetic measurement (magnetoencephalography, magnetic nanoparticle imaging, multi-mode brain-computer interface), electromagnetic precision measurement (optical pumped atomic magnetometer, magnetoresistance sensor, fluxgate sensor), intelligent image and signal processing (source imaging, intelligent identification and quantification, inversion and reconstruction), etc.. He has published more than 30 papers, and authorized 2 USA patents and 3 Chinese patents. After joining ShanghaiTech University, he has been granted more than 6 million RMB research funding. He is the instructor of the courses: electric circuit (undergraduate) and electromagnetic sensing and testing (graduate), which have achieved positive feedbakc from the students. He serves as a reviewer for journals: IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, IEEE SENSORS JOURNAL, IEEE TRANSACTIONS ON MAGNETICS and NDT & E INTERNATIONAL, etc.


SELECTED PUBLICATIONS

  

  1. Y. Wang, Y. Niu, Y. Wei, and C. Ye, “Multi-frequency imaging with non-linear calibration of magnetoresistance sensors for surface and buried defects inspection,” NDT E Int., vol. 132, p. 102706, Dec. 2022, doi: 10.1016/j.ndteint.2022.102706.

  2. K. Sun, P. Qi, X. Tao, W. Zhao, and C. Ye, “Vector Magnetic Field Imaging With High-Resolution TMR Sensor Arrays for Metal Structure Inspection,” IEEE Sens. J., vol. 22, no. 14, pp. 14513–14521, Jul. 2022, doi: 10.1109/JSEN.2022.3181366.

  3. K. Sun, Y. Tao, X. Tao, Y. He, and C. Ye, “Model-Based POD Evaluation with Parameters from Experiment: A Comparative Study of TMR and Coil Array Probes,” J. Nondestruct. Eval., vol. 41, no. 1, p. 27, Mar. 2022, doi: 10.1007/s10921-022-00858-1.

  4. Y. Wang, Y. Nie, P. Qi, N. Zhang, and C. Ye, “Inspection of Defect Under Thick Insulation Based on Magnetic Imaging With TMR Array Sensors,” IEEE Trans. Magn., vol. 58, no. 3, p. 6200510, Mar. 2022, doi: 10.1109/TMAG.2021.3138587.

  5. W. Zhao, X. Tao, C. Ye, and Y. Tao, “Tunnel Magnetoresistance Sensor with AC Modulation and Impedance Compensation for Ultra-Weak Magnetic Field Measurement,” Sensors, vol. 22, no. 3, p. 1021, Feb. 2022, doi: 10.3390/s22031021.

  6. Y. Wei et al., “Electrical Compensation for Magnetization Distortion of Magnetic Fluxgate Current Sensor,” IEEE Trans. Instrum. Meas., vol. 71, p. 9503409, 2022, doi: 10.1109/TIM.2022.3152861.

  7. N. Zhang, L. Peng, Y. He, and C. Ye, “Flexible Probe with Array Tunneling Magnetoresistance Sensors for Curved Structure Inspection,” IEEE Transactions on Instrumentation and Measurement, pp. 1–1, 2022, doi: 10.1109/TIM.2022.3149102.

  8. C. Ye, N. Zhang, L. Peng, and Y. Tao, “Flexible Array Probe with In-plane Differential Multi-Channels for Inspection of Micro-defects on Curved Surface,” IEEE Transactions on Industrial Electronics, pp. 1–1, 2021, doi: 10.1109/TIE.2021.3050376.

  9. N. Zhang, L. Peng, X. Tao, and C. Ye, “Flexible ECT probe with front-end differential setting for inspection of curved CFRP structures,” Composites Part B: Engineering, vol. 227, p. 109404, Dec. 2021, doi: 10.1016/j.compositesb.2021.109404.

  10. C. Ye, S. Laureti, H. Malekmohammadi, Y. Wang, and M. Ricci, “Swept-Frequency eddy current excitation for TMR array sensor and Pulse-Compression: Feasibility study and quantitative comparison of time and frequency domains processing,” Measurement, vol. 187, p. 110249, Jan. 2022, doi: 10.1016/j.measurement.2021.110249.

  11. Y. Bai, X. Tao, X. Chen, J. Yu, and C. Ye, “Fusion Images of Versatile Array Sensors for Multiobject Detection,” IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1–9, 2021, doi: 10.1109/TIM.2021.3124842.

  12. Y. Wang, Y. Niu, and C. Ye, “Optically pumped magnetometer with dynamic common mode magnetic field compensation,” Sensors and Actuators A: Physical, vol. 332, p. 113195, Dec. 2021, doi: 10.1016/j.sna.2021.113195.

  13. X. Tao, L. Peng, Y. Tao, and C. Ye, “Inspection of Defects in Weld Using Differential Array ECT Probe and Deep Learning Algorithm,” IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1–9, 2021, doi: 10.1109/TIM.2021.3099566.

  14. N. Zhang, C. Ye, L. Peng, and Y. Tao, “Eddy Current Probe with Three-Phase Excitation and Integrated Array TMR Sensors,” IEEE Transactions on Industrial Electronics, pp. 1–1, 2020, doi: 10.1109/TIE.2020.2989704.

  15. Y. Bai, C. Ye, X. Tao, N. Zhang, and X. Li, “Magnetic Imaging of Sludge Outside Steam Generator Tube With Array Magnetoresistance Sensors,” IEEE Sensors Journal, vol. 21, no. 6, pp. 7439–7448, Mar. 2021, doi: 10.1109/JSEN.2020.3047822.

  16. C. Ye, Y. Wang, M. Wang, L. Udpa, and S. S. Udpa, “Frequency domain analysis of magnetic field images obtained using TMR array sensors for subsurface defect detection and quantification,” NDT & E International, vol. 116, p. 102284, Dec. 2020, doi: 10.1016/j.ndteint.2020.102284.

  17. M. Wang, X. Tao, L. Peng, and C. Ye, “Imaging of Magnetic Nanoparticles Using Small TMR Sensor with An Excitation-Compensation Scheme,” IEEE Sensors Journal, pp. 1–1, 2020, doi: 10.1109/JSEN.2020.2996741.

  18. L. Peng, N. Zhang, Y. Tao, and C. Ye, “Fastener Tilt Assessment Based on Magnetic Field Image Obtained With Array Tunnel Magnetoresistance Sensors,” IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1–9, 2021, doi: 10.1109/TIM.2020.3011782.

  19. Y. Tao, L. Peng, X. Li, and C. Ye, “Eddy Current Probe With Integrated Tunnel Magnetoresistance Array Sensors for Tube Inspection,” IEEE Transactions on Magnetics, vol. 56, no. 5, pp. 1–8, May 2020, doi: 10.1109/TMAG.2020.2981435.

  20. Y. Wang, C. Ye, and M. Wang, “Synthetic Magnetic Field Imaging With Triangle Excitation Coil for Inspection of Any Orientation Defect,” IEEE Transactions on Instrumentation and Measurement, pp. 1–9, 2019, doi: 10.1109/TIM.2019.2903610.

  21. M. Wang, Y. Wang, L. Peng, and C. Ye, “Measurement of Triaxial Magnetocardiography Using High Sensitivity Tunnel Magnetoresistance Sensor,” IEEE Sensors Journal, vol. 19, no. 21, pp. 9610–9615, Nov. 2019, doi: 10.1109/JSEN.2019.2927086.

  22. N. Zhang, C. Ye, L. Peng, and Y. Tao, “Novel Array Eddy Current Sensor With Three-Phase Excitation,” IEEE Sensors Journal, vol. 19, no. 18, pp. 7896–7905, Sep. 2019, doi: 10.1109/JSEN.2019.2919661.

  23. C. Ye, Y. Wang, and Y. Tao, “High-Density Large-Scale TMR Sensor Array for Magnetic Field Imaging,” IEEE Transactions on Instrumentation and Measurement, vol. 68, no. 7, pp. 2594–2601, Jul. 2019, doi: 10.1109/TIM.2018.2866299.

  24. C. Ye et al., “A decay time approach for linear measurement of electrical conductivity,” NDT E Int., vol. 102, pp. 169–174, Mar. 2019, doi: 10.1016/j.ndteint.2018.12.001.